MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplasti...

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Hauptverfasser:	KERÄNEN, Antti, HEIKKINEN, Mikko, HAAG, Ronald
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	KERÄNEN, Antti HEIKKINEN, Mikko HAAG, Ronald
description	Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.
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language	eng ; fre ; ger
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE
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