DUAL CURE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

Bibliographische Detailangaben

Hauptverfasser:	THOMAS, Ryan, OLSEN, Matthew, LU, Gang, SHEPHARD, Nick
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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