SEMICONDUCTOR PACKAGE
A semiconductor package comprising a redistribution substrate having first and second surfaces disposed opposite to each other, and including an insulation member, a plurality of redistribution layers disposed on different levels in the insulation member, and a redistribution via connecting the redi...
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| creator | KIM, Jong Youn PARK, Jung Ho BAE, Min Jun |
| description | A semiconductor package comprising a redistribution substrate having first and second surfaces disposed opposite to each other, and including an insulation member, a plurality of redistribution layers disposed on different levels in the insulation member, and a redistribution via connecting the redistribution layers disposed on neighboring levels and having a shape narrowing from the second surface toward the first surface in a first direction. The semiconductor package further comprises a plurality of under bump metallurgy (UBM) layers, each of the plurality of UBM layers including a UBM pad disposed on the first surface of the redistribution substrate, and a UBM via connected to a redistribution layer adjacent to the first surface among the plurality of redistribution layers and connected to the UBM pad, and having a shape narrowing in a second direction opposite to the first direction. The semiconductor package further comprises at least one semiconductor chip disposed on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to a redistribution layer adjacent to the second surface among the plurality of redistribution layers. |
| format | Patent |
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The semiconductor package further comprises a plurality of under bump metallurgy (UBM) layers, each of the plurality of UBM layers including a UBM pad disposed on the first surface of the redistribution substrate, and a UBM via connected to a redistribution layer adjacent to the first surface among the plurality of redistribution layers and connected to the UBM pad, and having a shape narrowing in a second direction opposite to the first direction. The semiconductor package further comprises at least one semiconductor chip disposed on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to a redistribution layer adjacent to the second surface among the plurality of redistribution layers.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220810&DB=EPODOC&CC=EP&NR=3671830B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220810&DB=EPODOC&CC=EP&NR=3671830B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Jong Youn</creatorcontrib><creatorcontrib>PARK, Jung Ho</creatorcontrib><creatorcontrib>BAE, Min Jun</creatorcontrib><title>SEMICONDUCTOR PACKAGE</title><description>A semiconductor package comprising a redistribution substrate having first and second surfaces disposed opposite to each other, and including an insulation member, a plurality of redistribution layers disposed on different levels in the insulation member, and a redistribution via connecting the redistribution layers disposed on neighboring levels and having a shape narrowing from the second surface toward the first surface in a first direction. The semiconductor package further comprises a plurality of under bump metallurgy (UBM) layers, each of the plurality of UBM layers including a UBM pad disposed on the first surface of the redistribution substrate, and a UBM via connected to a redistribution layer adjacent to the first surface among the plurality of redistribution layers and connected to the UBM pad, and having a shape narrowing in a second direction opposite to the first direction. The semiconductor package further comprises at least one semiconductor chip disposed on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to a redistribution layer adjacent to the second surface among the plurality of redistribution layers.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBANdvX1dPb3cwl1DvEPUghwdPZ2dHflYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGZuaGFsYGTobGRCgBAGKwHok</recordid><startdate>20220810</startdate><enddate>20220810</enddate><creator>KIM, Jong Youn</creator><creator>PARK, Jung Ho</creator><creator>BAE, Min Jun</creator><scope>EVB</scope></search><sort><creationdate>20220810</creationdate><title>SEMICONDUCTOR PACKAGE</title><author>KIM, Jong Youn ; PARK, Jung Ho ; BAE, Min Jun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3671830B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Jong Youn</creatorcontrib><creatorcontrib>PARK, Jung Ho</creatorcontrib><creatorcontrib>BAE, Min Jun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Jong Youn</au><au>PARK, Jung Ho</au><au>BAE, Min Jun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR PACKAGE</title><date>2022-08-10</date><risdate>2022</risdate><abstract>A semiconductor package comprising a redistribution substrate having first and second surfaces disposed opposite to each other, and including an insulation member, a plurality of redistribution layers disposed on different levels in the insulation member, and a redistribution via connecting the redistribution layers disposed on neighboring levels and having a shape narrowing from the second surface toward the first surface in a first direction. The semiconductor package further comprises a plurality of under bump metallurgy (UBM) layers, each of the plurality of UBM layers including a UBM pad disposed on the first surface of the redistribution substrate, and a UBM via connected to a redistribution layer adjacent to the first surface among the plurality of redistribution layers and connected to the UBM pad, and having a shape narrowing in a second direction opposite to the first direction. The semiconductor package further comprises at least one semiconductor chip disposed on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to a redistribution layer adjacent to the second surface among the plurality of redistribution layers.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR PACKAGE |
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