WAFER-LEVEL METHODS FOR MANUFACTURING UNIFORM LAYERS OF MATERIAL ON OPTOELECTRONIC MODULES

WAFER-LEVEL METHODS FOR MANUFACTURING UNIFORM LAYERS OF MATERIAL ON OPTOELECTRONIC MODULES

Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and har...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LENART, Robert, AHISHALI, Özkan, HANSELMANN, Sonja
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Beschreibung
Zusammenfassung:Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.