DEVICE AND METHOD FOR A THIN FILM RESISTOR USING A VIA RETARDATION LAYER

A device and method for fabricating an integrated circuit (IC) chip is disclosed. The method includes depositing a first thin film resistor material on a first inter-level dielectric (ILD) layer; depositing an etch retardant layer overlying the first thin film resistor material; and patterning and e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANDE, Dhishan, ALI, Abbas, HONG, Qi-zhong
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESISTORS SEMICONDUCTOR DEVICES
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