COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES
The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxid...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | BERUBE, Gregory GARCIA, Virginia C PERSONS, Ryan SGRICCIA, Matthew |
| description | The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxide, at least one adhesion promoting additive comprising aluminum oxide, cerium oxide, or combinations thereof, and an organic vehicle. The invention is also directed to an electroconductive paste for use in forming an electrode on an aluminum nitride substrate, which includes at least three types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3645474A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3645474A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3645474A13</originalsourceid><addsrcrecordid>eNrjZDBz9g8IcA3Sdfb3C3H09PP0c1cI8fB09lYICPL0C1Fw9XF1DgnyB8q6hDqHeIa5KgQ4Boe4BvMwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGMzE1MTcxNHQ2MilAAA9HYn-Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES</title><source>esp@cenet</source><creator>BERUBE, Gregory ; GARCIA, Virginia C ; PERSONS, Ryan ; SGRICCIA, Matthew</creator><creatorcontrib>BERUBE, Gregory ; GARCIA, Virginia C ; PERSONS, Ryan ; SGRICCIA, Matthew</creatorcontrib><description>The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxide, at least one adhesion promoting additive comprising aluminum oxide, cerium oxide, or combinations thereof, and an organic vehicle. The invention is also directed to an electroconductive paste for use in forming an electrode on an aluminum nitride substrate, which includes at least three types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; CONDUCTORS ; ELECTRICITY ; GLASS ; INSULATORS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; METALLURGY ; MINERAL OR SLAG WOOL ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200506&DB=EPODOC&CC=EP&NR=3645474A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200506&DB=EPODOC&CC=EP&NR=3645474A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BERUBE, Gregory</creatorcontrib><creatorcontrib>GARCIA, Virginia C</creatorcontrib><creatorcontrib>PERSONS, Ryan</creatorcontrib><creatorcontrib>SGRICCIA, Matthew</creatorcontrib><title>COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES</title><description>The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxide, at least one adhesion promoting additive comprising aluminum oxide, cerium oxide, or combinations thereof, and an organic vehicle. The invention is also directed to an electroconductive paste for use in forming an electrode on an aluminum nitride substrate, which includes at least three types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>INSULATORS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz9g8IcA3Sdfb3C3H09PP0c1cI8fB09lYICPL0C1Fw9XF1DgnyB8q6hDqHeIa5KgQ4Boe4BvMwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGMzE1MTcxNHQ2MilAAA9HYn-Q</recordid><startdate>20200506</startdate><enddate>20200506</enddate><creator>BERUBE, Gregory</creator><creator>GARCIA, Virginia C</creator><creator>PERSONS, Ryan</creator><creator>SGRICCIA, Matthew</creator><scope>EVB</scope></search><sort><creationdate>20200506</creationdate><title>COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES</title><author>BERUBE, Gregory ; GARCIA, Virginia C ; PERSONS, Ryan ; SGRICCIA, Matthew</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3645474A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>INSULATORS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><toplevel>online_resources</toplevel><creatorcontrib>BERUBE, Gregory</creatorcontrib><creatorcontrib>GARCIA, Virginia C</creatorcontrib><creatorcontrib>PERSONS, Ryan</creatorcontrib><creatorcontrib>SGRICCIA, Matthew</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BERUBE, Gregory</au><au>GARCIA, Virginia C</au><au>PERSONS, Ryan</au><au>SGRICCIA, Matthew</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES</title><date>2020-05-06</date><risdate>2020</risdate><abstract>The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxide, at least one adhesion promoting additive comprising aluminum oxide, cerium oxide, or combinations thereof, and an organic vehicle. The invention is also directed to an electroconductive paste for use in forming an electrode on an aluminum nitride substrate, which includes at least three types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3645474A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CABLES CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CONDUCTORS ELECTRICITY GLASS INSULATORS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS |
| title | COPPER-CONTAINING THICK PRINT ELECTROCONDUCTIVE PASTES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T13%3A44%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BERUBE,%20Gregory&rft.date=2020-05-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3645474A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |