CHIP PACKAGE AND CHIP THEREOF

A microchip (200) is electrically connected to a substrate (100) to become a chip package, preferably for LED. A chip (200) of the package includes a body (210) and at least one electrode (220, 230) which is disposed and exposed on a surface of the body (210). The electrode (220, 230) includes a con...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSIEH, Chin-Tang, SHIH, Cheng-Hung
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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