IMAGING ELEMENT AND ELECTRONIC DEVICE
The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal.A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a...
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creator | KUMAGAI Yoshimichi ABE Takashi YOSHITA Ryoto |
description | The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal.A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a light shielding part that shields light between the photoelectric conversion part and the holding part are provided. The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate having a predetermined thickness. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device. |
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The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate having a predetermined thickness. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. 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The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate having a predetermined thickness. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. 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The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate having a predetermined thickness. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
title | IMAGING ELEMENT AND ELECTRONIC DEVICE |
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