JOINING SYSTEM AND JOINING METHOD
A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit th...
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| creator | IWANO, Yoshihiro FURUYASHIKI, Kenji HIRAWAKI, Satoshi MORI, Takayuki YUCHI, Hiroshi YAMAMORI, Yoshinori AMAOKA, Kazuaki |
| description | A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | JOINING SYSTEM AND JOINING METHOD |
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