PROCESSING DEVICE AND METHOD FOR FORMING CONNECTION CONDUCTORS FOR SEMICONDUCTOR COMPONENTS

A processing device for forming connection conductors for semiconductor components, in particular for producing a periodic structure, which device includes a forming unit for forming at least one connection conductor. The processing device has an advancing unit which is designed to move the connection conductors and the forming unit relative to one another in a direction of advance, and the forming unit has at least one step element, at least one forming element which can be moved relative to the step element, and a forming-element moving unit for moving the forming element relative to the stop element, the forming element, stop element and forming-element moving unit being designed to cooperate such that the connection conductor can be bent by moving the forming element between the stop element and the forming element by the forming-element moving unit. A method for forming connection conductors for semiconductor components is also provided.