LASER REFLOW DEVICE
A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit configured to transfer a bonding object, the bond...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KIM, Nam Seong KIM, Byoung Cheol CHOI, Jae Joon KIM, Byung Roc |
| description | A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit configured to transfer a bonding object, the bonding object transfer unit comprising a stage for supporting the bonding object; a laser emission unit configured to emit laser to the bonding object by converting the laser to the form of a surface light source and a laser emission transfer unit configured to transfer the laser emission unit to an emission position or a stand-by position; and a beam transmission plate configured to apply pressure to the bonding object, the beam transmission plate being independently and separately mounted from the laser emission unit and being made of a material transmitting a laser beam in the form of a surface light source, and a beam transmission plate transfer unit configured to transfer the beam transmission plate to an operation position or a stand-by position. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3584826B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3584826B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3584826B13</originalsourceid><addsrcrecordid>eNrjZBD2cQx2DVIIcnXz8Q9XcHEN83R25WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxqYWJhZGZk6GxkQoAQAX8h3i</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LASER REFLOW DEVICE</title><source>esp@cenet</source><creator>KIM, Nam Seong ; KIM, Byoung Cheol ; CHOI, Jae Joon ; KIM, Byung Roc</creator><creatorcontrib>KIM, Nam Seong ; KIM, Byoung Cheol ; CHOI, Jae Joon ; KIM, Byung Roc</creatorcontrib><description>A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit configured to transfer a bonding object, the bonding object transfer unit comprising a stage for supporting the bonding object; a laser emission unit configured to emit laser to the bonding object by converting the laser to the form of a surface light source and a laser emission transfer unit configured to transfer the laser emission unit to an emission position or a stand-by position; and a beam transmission plate configured to apply pressure to the bonding object, the beam transmission plate being independently and separately mounted from the laser emission unit and being made of a material transmitting a laser beam in the form of a surface light source, and a beam transmission plate transfer unit configured to transfer the beam transmission plate to an operation position or a stand-by position.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=EP&NR=3584826B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=EP&NR=3584826B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Nam Seong</creatorcontrib><creatorcontrib>KIM, Byoung Cheol</creatorcontrib><creatorcontrib>CHOI, Jae Joon</creatorcontrib><creatorcontrib>KIM, Byung Roc</creatorcontrib><title>LASER REFLOW DEVICE</title><description>A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit configured to transfer a bonding object, the bonding object transfer unit comprising a stage for supporting the bonding object; a laser emission unit configured to emit laser to the bonding object by converting the laser to the form of a surface light source and a laser emission transfer unit configured to transfer the laser emission unit to an emission position or a stand-by position; and a beam transmission plate configured to apply pressure to the bonding object, the beam transmission plate being independently and separately mounted from the laser emission unit and being made of a material transmitting a laser beam in the form of a surface light source, and a beam transmission plate transfer unit configured to transfer the beam transmission plate to an operation position or a stand-by position.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD2cQx2DVIIcnXz8Q9XcHEN83R25WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxqYWJhZGZk6GxkQoAQAX8h3i</recordid><startdate>20240117</startdate><enddate>20240117</enddate><creator>KIM, Nam Seong</creator><creator>KIM, Byoung Cheol</creator><creator>CHOI, Jae Joon</creator><creator>KIM, Byung Roc</creator><scope>EVB</scope></search><sort><creationdate>20240117</creationdate><title>LASER REFLOW DEVICE</title><author>KIM, Nam Seong ; KIM, Byoung Cheol ; CHOI, Jae Joon ; KIM, Byung Roc</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3584826B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Nam Seong</creatorcontrib><creatorcontrib>KIM, Byoung Cheol</creatorcontrib><creatorcontrib>CHOI, Jae Joon</creatorcontrib><creatorcontrib>KIM, Byung Roc</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Nam Seong</au><au>KIM, Byoung Cheol</au><au>CHOI, Jae Joon</au><au>KIM, Byung Roc</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER REFLOW DEVICE</title><date>2024-01-17</date><risdate>2024</risdate><abstract>A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit configured to transfer a bonding object, the bonding object transfer unit comprising a stage for supporting the bonding object; a laser emission unit configured to emit laser to the bonding object by converting the laser to the form of a surface light source and a laser emission transfer unit configured to transfer the laser emission unit to an emission position or a stand-by position; and a beam transmission plate configured to apply pressure to the bonding object, the beam transmission plate being independently and separately mounted from the laser emission unit and being made of a material transmitting a laser beam in the form of a surface light source, and a beam transmission plate transfer unit configured to transfer the beam transmission plate to an operation position or a stand-by position.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3584826B1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER REFLOW DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T05%3A05%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20Nam%20Seong&rft.date=2024-01-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3584826B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |