INFRARED SENSOR CHIP, AND INFRARED SENSOR EMPLOYING SAME
An object of the present disclosure is to provide an infrared sensor which is configured to perform highly accurate self-diagnosis. To achieve the object, the present disclosure has a configuration including: a supporting substrate (13) having a cavity; at least one bridge section (14) extending dir...
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| creator | MATSUURA, Akira OKUDO, Takafumi HAGIHARA, Yosuke KAKIMOTO, Katsumi |
| description | An object of the present disclosure is to provide an infrared sensor which is configured to perform highly accurate self-diagnosis. To achieve the object, the present disclosure has a configuration including: a supporting substrate (13) having a cavity; at least one bridge section (14) extending directly above the cavity (12) and having at least one end (15) supported by the supporting substrate (13) and an other end (19); and a thermopile wiring (9) formed in the at least one bridge section (14) and including hot junctions (17) provided in the at least one bridge section (14) and cold junctions (18) provided directly above the supporting substrate (13), the hot junctions (17) being connected to the cold junctions (18). The at least one bridge section (14) is provided with: at least one breakage detection wiring (20) for detecting breakage of the at least one bridge section (14); and at least one heater wiring (22). The at least one breakage detection wiring (20) is wired along the thermopile wiring (9). The at least one heater wiring (22) is wired such that part of the at least one heater wiring (22) is in an area (21) between the other end (19) of the at least one bridge section (14) and the hot junctions (17). |
| format | Patent |
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To achieve the object, the present disclosure has a configuration including: a supporting substrate (13) having a cavity; at least one bridge section (14) extending directly above the cavity (12) and having at least one end (15) supported by the supporting substrate (13) and an other end (19); and a thermopile wiring (9) formed in the at least one bridge section (14) and including hot junctions (17) provided in the at least one bridge section (14) and cold junctions (18) provided directly above the supporting substrate (13), the hot junctions (17) being connected to the cold junctions (18). The at least one bridge section (14) is provided with: at least one breakage detection wiring (20) for detecting breakage of the at least one bridge section (14); and at least one heater wiring (22). The at least one breakage detection wiring (20) is wired along the thermopile wiring (9). 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To achieve the object, the present disclosure has a configuration including: a supporting substrate (13) having a cavity; at least one bridge section (14) extending directly above the cavity (12) and having at least one end (15) supported by the supporting substrate (13) and an other end (19); and a thermopile wiring (9) formed in the at least one bridge section (14) and including hot junctions (17) provided in the at least one bridge section (14) and cold junctions (18) provided directly above the supporting substrate (13), the hot junctions (17) being connected to the cold junctions (18). The at least one bridge section (14) is provided with: at least one breakage detection wiring (20) for detecting breakage of the at least one bridge section (14); and at least one heater wiring (22). The at least one breakage detection wiring (20) is wired along the thermopile wiring (9). The at least one heater wiring (22) is wired such that part of the at least one heater wiring (22) is in an area (21) between the other end (19) of the at least one bridge section (14) and the hot junctions (17).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING |
| title | INFRARED SENSOR CHIP, AND INFRARED SENSOR EMPLOYING SAME |
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