OVERMOLDED LEAD FRAME ASSEMBLY FOR PRESSURE SENSING APPLICATIONS
A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmo...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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