OVERMOLDED LEAD FRAME ASSEMBLY FOR PRESSURE SENSING APPLICATIONS

A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BAE, Jun H, HERRON, Andrew C, BROWN, David T
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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