TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE END PART STRUCTURE
Provided is: a terminal material for a connector terminal, which uses a copper or copper alloy substrate and is free from the occurrence of electrical corrosion, the connector terminal being crimped to an end of an electric wire that is formed from an aluminum wire material; and a terminal which use...
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creator | TARUTANI, Yoshie NAKAYA, Kiyotaka KUBOTA, Kenji |
description | Provided is: a terminal material for a connector terminal, which uses a copper or copper alloy substrate and is free from the occurrence of electrical corrosion, the connector terminal being crimped to an end of an electric wire that is formed from an aluminum wire material; and a terminal which uses this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2to 7.0 mg/cm2(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2to 2.0 mg/cm2(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive). |
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and a terminal which uses this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2to 7.0 mg/cm2(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2to 2.0 mg/cm2(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CURRENT COLLECTORS ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; LINE CONNECTORS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240522&DB=EPODOC&CC=EP&NR=3575448B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240522&DB=EPODOC&CC=EP&NR=3575448B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TARUTANI, Yoshie</creatorcontrib><creatorcontrib>NAKAYA, Kiyotaka</creatorcontrib><creatorcontrib>KUBOTA, Kenji</creatorcontrib><title>TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE END PART STRUCTURE</title><description>Provided is: a terminal material for a connector terminal, which uses a copper or copper alloy substrate and is free from the occurrence of electrical corrosion, the connector terminal being crimped to an end of an electric wire that is formed from an aluminum wire material; and a terminal which uses this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2to 7.0 mg/cm2(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2to 2.0 mg/cm2(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgIcQ3y9fRz9FHwdQQyPYEMN_8gBWd_Pz9X5xD_oGAdBZgKHQVHPxcFVx-geJCns0K4Z5CrgitQJMAxKEQhOCQo1DkkNMiVh4E1LTGnOJUXSnMzKLi5hjh76KYW5MenFhckJqfmpZbEuwYYm5qbmphYOBkaE6EEAAx1LqE</recordid><startdate>20240522</startdate><enddate>20240522</enddate><creator>TARUTANI, Yoshie</creator><creator>NAKAYA, Kiyotaka</creator><creator>KUBOTA, Kenji</creator><scope>EVB</scope></search><sort><creationdate>20240522</creationdate><title>TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE END PART STRUCTURE</title><author>TARUTANI, Yoshie ; NAKAYA, Kiyotaka ; KUBOTA, Kenji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3575448B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>TARUTANI, Yoshie</creatorcontrib><creatorcontrib>NAKAYA, Kiyotaka</creatorcontrib><creatorcontrib>KUBOTA, Kenji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TARUTANI, Yoshie</au><au>NAKAYA, Kiyotaka</au><au>KUBOTA, Kenji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE END PART STRUCTURE</title><date>2024-05-22</date><risdate>2024</risdate><abstract>Provided is: a terminal material for a connector terminal, which uses a copper or copper alloy substrate and is free from the occurrence of electrical corrosion, the connector terminal being crimped to an end of an electric wire that is formed from an aluminum wire material; and a terminal which uses this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2to 7.0 mg/cm2(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2to 2.0 mg/cm2(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LINE CONNECTORS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
title | TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE END PART STRUCTURE |
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