SENSOR PACKAGE STRUCTURE

A sensor package structure (100) includes a substrate (1), an electronic chip (2) fixed on the substrate (1) by flip-chip bonding, a sealant (3) disposed on the substrate (1) and embedding the electronic chip (2) therein, a sensor chip (4) with a size larger than that of the electronic chip (2), a light-permeable sheet (5), a plurality of metal wires (6) electrically connected to the substrate (1) and the sensor chip (4), and a package body (7). A bottom surface (42) of the sensor chip (4) is disposed on the sealant (3) to be spaced apart from the electronic chip (2). A lateral surface (43) of the sensor chip (4) is horizontally spaced apart from that of the sealant (3) by a distance (Da, Db) less than or equal to 3mm. The package body (7) is disposed on the substrate (1) and covers the metal wires (6) as well as the lateral sides (31) of the sealant (3) and the sensor chip (4). The light-permeable sheet (5) is fixed above the sensor chip (4) through the package body (7).