CR ALLOY TARGET MATERIAL

Provided is a Cr alloy target material with which formation of craters on the surface of the Cr alloy target material during film formation can be limited and the adhesion of droplets on the material being treated can be limited. The Cr alloy target material is represented by an atom ratio compositi...

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Bibliographische Detailangaben
Hauptverfasser:	SAKAMAKI, Koichi, SAITO, Kazuya, SOGAME, Hiroaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	Provided is a Cr alloy target material with which formation of craters on the surface of the Cr alloy target material during film formation can be limited and the adhesion of droplets on the material being treated can be limited. The Cr alloy target material is represented by an atom ratio composition formula of Cr100-x-yM1xM2y, wherein 0.1≤x≤21.0, 0.1≤y≤23.0, M1 is at least one kind of element selected from Ti and V, and M2 is at least one kind of element selected from Mo, Mn, B, W, Nb and Ta, with the balance being unavoidable impurities. The Cr alloy target material contains 10-1000 mass ppm of oxygen as an unavoidable impurity.