DEVICES WITH MOUNTED COMPONENTS

Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stre...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HURBI, Erin Elizabeth, NIKKHOO, Michael, TOLENO, Brian Joseph, MARKOVSKY, Igor
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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