MATERIALS FOR ELECTRONIC DEVICES
The present application relates to a polymer containing at least one structural unit of a formula (I) and at least one further structural unit selected from structural units A, B and C. The present application further relates to the use of the polymer in an electronic device and to a process for pre...
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| creator | BURKHART, Beate HEIL, Holger KOENEN, Nils SCHEIBLE, Katja Maria |
| description | The present application relates to a polymer containing at least one structural unit of a formula (I) and at least one further structural unit selected from structural units A, B and C. The present application further relates to the use of the polymer in an electronic device and to a process for preparing the polymer. The present application further relates to an electronic device comprising the polymer. |
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The present application further relates to the use of the polymer in an electronic device and to a process for preparing the polymer. The present application further relates to an electronic device comprising the polymer.</description><language>eng ; fre ; ger</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191030&DB=EPODOC&CC=EP&NR=3559078A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191030&DB=EPODOC&CC=EP&NR=3559078A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BURKHART, Beate</creatorcontrib><creatorcontrib>HEIL, Holger</creatorcontrib><creatorcontrib>KOENEN, Nils</creatorcontrib><creatorcontrib>SCHEIBLE, Katja Maria</creatorcontrib><title>MATERIALS FOR ELECTRONIC DEVICES</title><description>The present application relates to a polymer containing at least one structural unit of a formula (I) and at least one further structural unit selected from structural units A, B and C. The present application further relates to the use of the polymer in an electronic device and to a process for preparing the polymer. The present application further relates to an electronic device comprising the polymer.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwdQxxDfJ09AlWcPMPUnD1cXUOCfL383RWcHEN83R2DeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcamppYG5haOhsZEKAEAtCghjQ</recordid><startdate>20191030</startdate><enddate>20191030</enddate><creator>BURKHART, Beate</creator><creator>HEIL, Holger</creator><creator>KOENEN, Nils</creator><creator>SCHEIBLE, Katja Maria</creator><scope>EVB</scope></search><sort><creationdate>20191030</creationdate><title>MATERIALS FOR ELECTRONIC DEVICES</title><author>BURKHART, Beate ; HEIL, Holger ; KOENEN, Nils ; SCHEIBLE, Katja Maria</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3559078A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>BURKHART, Beate</creatorcontrib><creatorcontrib>HEIL, Holger</creatorcontrib><creatorcontrib>KOENEN, Nils</creatorcontrib><creatorcontrib>SCHEIBLE, Katja Maria</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BURKHART, Beate</au><au>HEIL, Holger</au><au>KOENEN, Nils</au><au>SCHEIBLE, Katja Maria</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MATERIALS FOR ELECTRONIC DEVICES</title><date>2019-10-30</date><risdate>2019</risdate><abstract>The present application relates to a polymer containing at least one structural unit of a formula (I) and at least one further structural unit selected from structural units A, B and C. The present application further relates to the use of the polymer in an electronic device and to a process for preparing the polymer. The present application further relates to an electronic device comprising the polymer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | MATERIALS FOR ELECTRONIC DEVICES |
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