SEMICONDUCTOR DEVICE
According to an embodiment, a semiconductor device includes a first metal plate, a second metal plate, and two or more semiconductor units. The two or more semiconductor units are disposed on the first metal plate. The each of the two or more semiconductor units includes a first metal member, a seco...
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| creator | WATANABE, Naotake IIO, Naotaka SEKIYA, Hiroki ITO, Hiroaki OHBU, Toshiharu HIRATSUKA, Daisuke TAKIMOTO, Kazuyasu HISAZATO, Yuuji TADA, Nobumitsu MATSUMURA, Hitoshi ICHIKURA, Yuta YAMANARI, Naoki |
| description | According to an embodiment, a semiconductor device includes a first metal plate, a second metal plate, and two or more semiconductor units. The two or more semiconductor units are disposed on the first metal plate. The each of the two or more semiconductor units includes a first metal member, a second metal member, and a semiconductor element. The first metal member has a first connection surface connected to the first major surface. The second metal member has a second connection surface connected to the second major surface. The semiconductor element includes an active region having surfaces respectively opposing the first connection surface and the second connection surface. A surface area of the first connection surface is greater than a surface area of the surface of the active region opposing the first connection surface. A surface area of the second connection surface is greater than a surface area of the surface of the active region opposing the second connection surface. |
| format | Patent |
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The two or more semiconductor units are disposed on the first metal plate. The each of the two or more semiconductor units includes a first metal member, a second metal member, and a semiconductor element. The first metal member has a first connection surface connected to the first major surface. The second metal member has a second connection surface connected to the second major surface. The semiconductor element includes an active region having surfaces respectively opposing the first connection surface and the second connection surface. A surface area of the first connection surface is greater than a surface area of the surface of the active region opposing the first connection surface. A surface area of the second connection surface is greater than a surface area of the surface of the active region opposing the second connection surface.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191016&DB=EPODOC&CC=EP&NR=3553820A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191016&DB=EPODOC&CC=EP&NR=3553820A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATANABE, Naotake</creatorcontrib><creatorcontrib>IIO, Naotaka</creatorcontrib><creatorcontrib>SEKIYA, Hiroki</creatorcontrib><creatorcontrib>ITO, Hiroaki</creatorcontrib><creatorcontrib>OHBU, Toshiharu</creatorcontrib><creatorcontrib>HIRATSUKA, Daisuke</creatorcontrib><creatorcontrib>TAKIMOTO, Kazuyasu</creatorcontrib><creatorcontrib>HISAZATO, Yuuji</creatorcontrib><creatorcontrib>TADA, Nobumitsu</creatorcontrib><creatorcontrib>MATSUMURA, Hitoshi</creatorcontrib><creatorcontrib>ICHIKURA, Yuta</creatorcontrib><creatorcontrib>YAMANARI, Naoki</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>According to an embodiment, a semiconductor device includes a first metal plate, a second metal plate, and two or more semiconductor units. The two or more semiconductor units are disposed on the first metal plate. The each of the two or more semiconductor units includes a first metal member, a second metal member, and a semiconductor element. The first metal member has a first connection surface connected to the first major surface. The second metal member has a second connection surface connected to the second major surface. The semiconductor element includes an active region having surfaces respectively opposing the first connection surface and the second connection surface. A surface area of the first connection surface is greater than a surface area of the surface of the active region opposing the first connection surface. A surface area of the second connection surface is greater than a surface area of the surface of the active region opposing the second connection surface.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcampsYWRgaOhsZEKAEAR5geRg</recordid><startdate>20191016</startdate><enddate>20191016</enddate><creator>WATANABE, Naotake</creator><creator>IIO, Naotaka</creator><creator>SEKIYA, Hiroki</creator><creator>ITO, Hiroaki</creator><creator>OHBU, Toshiharu</creator><creator>HIRATSUKA, Daisuke</creator><creator>TAKIMOTO, Kazuyasu</creator><creator>HISAZATO, Yuuji</creator><creator>TADA, Nobumitsu</creator><creator>MATSUMURA, Hitoshi</creator><creator>ICHIKURA, Yuta</creator><creator>YAMANARI, Naoki</creator><scope>EVB</scope></search><sort><creationdate>20191016</creationdate><title>SEMICONDUCTOR DEVICE</title><author>WATANABE, Naotake ; IIO, Naotaka ; SEKIYA, Hiroki ; ITO, Hiroaki ; OHBU, Toshiharu ; HIRATSUKA, Daisuke ; TAKIMOTO, Kazuyasu ; HISAZATO, Yuuji ; TADA, Nobumitsu ; MATSUMURA, Hitoshi ; ICHIKURA, Yuta ; YAMANARI, Naoki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3553820A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WATANABE, Naotake</creatorcontrib><creatorcontrib>IIO, Naotaka</creatorcontrib><creatorcontrib>SEKIYA, Hiroki</creatorcontrib><creatorcontrib>ITO, Hiroaki</creatorcontrib><creatorcontrib>OHBU, Toshiharu</creatorcontrib><creatorcontrib>HIRATSUKA, Daisuke</creatorcontrib><creatorcontrib>TAKIMOTO, Kazuyasu</creatorcontrib><creatorcontrib>HISAZATO, Yuuji</creatorcontrib><creatorcontrib>TADA, Nobumitsu</creatorcontrib><creatorcontrib>MATSUMURA, Hitoshi</creatorcontrib><creatorcontrib>ICHIKURA, Yuta</creatorcontrib><creatorcontrib>YAMANARI, Naoki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WATANABE, Naotake</au><au>IIO, Naotaka</au><au>SEKIYA, Hiroki</au><au>ITO, Hiroaki</au><au>OHBU, Toshiharu</au><au>HIRATSUKA, Daisuke</au><au>TAKIMOTO, Kazuyasu</au><au>HISAZATO, Yuuji</au><au>TADA, Nobumitsu</au><au>MATSUMURA, Hitoshi</au><au>ICHIKURA, Yuta</au><au>YAMANARI, Naoki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2019-10-16</date><risdate>2019</risdate><abstract>According to an embodiment, a semiconductor device includes a first metal plate, a second metal plate, and two or more semiconductor units. The two or more semiconductor units are disposed on the first metal plate. The each of the two or more semiconductor units includes a first metal member, a second metal member, and a semiconductor element. The first metal member has a first connection surface connected to the first major surface. The second metal member has a second connection surface connected to the second major surface. The semiconductor element includes an active region having surfaces respectively opposing the first connection surface and the second connection surface. A surface area of the first connection surface is greater than a surface area of the surface of the active region opposing the first connection surface. A surface area of the second connection surface is greater than a surface area of the surface of the active region opposing the second connection surface.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE |
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