ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS

ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS

A calibration arrangement (1) has a sealable and thermally-isolated chamber (10) comprising a socket mount (15) having a number of reference samples (18) in thermal contact with the socket mount (15) and a number of sample sockets (16) for devices-under test, DUTs (17), with each sample socket (16)...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: De Jong, Frans, Nenadovic, Nebojsa, Ten Cate, Hans, Valter, Andreis, Calaerts, Geert, De Kok, Renie, Suy, Hilco, Sakic, Agata
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator De Jong, Frans
Nenadovic, Nebojsa
Ten Cate, Hans
Valter, Andreis
Calaerts, Geert
De Kok, Renie
Suy, Hilco
Sakic, Agata
description A calibration arrangement (1) has a sealable and thermally-isolated chamber (10) comprising a socket mount (15) having a number of reference samples (18) in thermal contact with the socket mount (15) and a number of sample sockets (16) for devices-under test, DUTs (17), with each sample socket (16) being arranged in proximity to and associated to at least one of the reference samples (18). The arrangement (1) further comprises a thermal chuck (13) and a circuit board (14), which is configured to provide electrical connection to the reference samples (18) in the socket mount (15) and DUTs (17) in the sample sockets (16). The thermal chuck (13) is configured to thermalize the socket mount (15) and the circuit board (14) to a temperature set point.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3546908B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3546908B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3546908B13</originalsourceid><addsrcrecordid>eNrjZLByDApy9HN39XX1C1Fw9HNR8HUN8fB3UXDzD1JwdvTxdApyDPH0c1cIcfUNcAWyQ4NcFYJd_YL9g4J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CxqYmZpYGFk6ExEUoAcw8o2w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS</title><source>esp@cenet</source><creator>De Jong, Frans ; Nenadovic, Nebojsa ; Ten Cate, Hans ; Valter, Andreis ; Calaerts, Geert ; De Kok, Renie ; Suy, Hilco ; Sakic, Agata</creator><creatorcontrib>De Jong, Frans ; Nenadovic, Nebojsa ; Ten Cate, Hans ; Valter, Andreis ; Calaerts, Geert ; De Kok, Renie ; Suy, Hilco ; Sakic, Agata</creatorcontrib><description>A calibration arrangement (1) has a sealable and thermally-isolated chamber (10) comprising a socket mount (15) having a number of reference samples (18) in thermal contact with the socket mount (15) and a number of sample sockets (16) for devices-under test, DUTs (17), with each sample socket (16) being arranged in proximity to and associated to at least one of the reference samples (18). The arrangement (1) further comprises a thermal chuck (13) and a circuit board (14), which is configured to provide electrical connection to the reference samples (18) in the socket mount (15) and DUTs (17) in the sample sockets (16). The thermal chuck (13) is configured to thermalize the socket mount (15) and the circuit board (14) to a temperature set point.</description><language>eng ; fre ; ger</language><subject>MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210505&amp;DB=EPODOC&amp;CC=EP&amp;NR=3546908B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210505&amp;DB=EPODOC&amp;CC=EP&amp;NR=3546908B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>De Jong, Frans</creatorcontrib><creatorcontrib>Nenadovic, Nebojsa</creatorcontrib><creatorcontrib>Ten Cate, Hans</creatorcontrib><creatorcontrib>Valter, Andreis</creatorcontrib><creatorcontrib>Calaerts, Geert</creatorcontrib><creatorcontrib>De Kok, Renie</creatorcontrib><creatorcontrib>Suy, Hilco</creatorcontrib><creatorcontrib>Sakic, Agata</creatorcontrib><title>ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS</title><description>A calibration arrangement (1) has a sealable and thermally-isolated chamber (10) comprising a socket mount (15) having a number of reference samples (18) in thermal contact with the socket mount (15) and a number of sample sockets (16) for devices-under test, DUTs (17), with each sample socket (16) being arranged in proximity to and associated to at least one of the reference samples (18). The arrangement (1) further comprises a thermal chuck (13) and a circuit board (14), which is configured to provide electrical connection to the reference samples (18) in the socket mount (15) and DUTs (17) in the sample sockets (16). The thermal chuck (13) is configured to thermalize the socket mount (15) and the circuit board (14) to a temperature set point.</description><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLByDApy9HN39XX1C1Fw9HNR8HUN8fB3UXDzD1JwdvTxdApyDPH0c1cIcfUNcAWyQ4NcFYJd_YL9g4J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CxqYmZpYGFk6ExEUoAcw8o2w</recordid><startdate>20210505</startdate><enddate>20210505</enddate><creator>De Jong, Frans</creator><creator>Nenadovic, Nebojsa</creator><creator>Ten Cate, Hans</creator><creator>Valter, Andreis</creator><creator>Calaerts, Geert</creator><creator>De Kok, Renie</creator><creator>Suy, Hilco</creator><creator>Sakic, Agata</creator><scope>EVB</scope></search><sort><creationdate>20210505</creationdate><title>ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS</title><author>De Jong, Frans ; Nenadovic, Nebojsa ; Ten Cate, Hans ; Valter, Andreis ; Calaerts, Geert ; De Kok, Renie ; Suy, Hilco ; Sakic, Agata</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3546908B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>De Jong, Frans</creatorcontrib><creatorcontrib>Nenadovic, Nebojsa</creatorcontrib><creatorcontrib>Ten Cate, Hans</creatorcontrib><creatorcontrib>Valter, Andreis</creatorcontrib><creatorcontrib>Calaerts, Geert</creatorcontrib><creatorcontrib>De Kok, Renie</creatorcontrib><creatorcontrib>Suy, Hilco</creatorcontrib><creatorcontrib>Sakic, Agata</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>De Jong, Frans</au><au>Nenadovic, Nebojsa</au><au>Ten Cate, Hans</au><au>Valter, Andreis</au><au>Calaerts, Geert</au><au>De Kok, Renie</au><au>Suy, Hilco</au><au>Sakic, Agata</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS</title><date>2021-05-05</date><risdate>2021</risdate><abstract>A calibration arrangement (1) has a sealable and thermally-isolated chamber (10) comprising a socket mount (15) having a number of reference samples (18) in thermal contact with the socket mount (15) and a number of sample sockets (16) for devices-under test, DUTs (17), with each sample socket (16) being arranged in proximity to and associated to at least one of the reference samples (18). The arrangement (1) further comprises a thermal chuck (13) and a circuit board (14), which is configured to provide electrical connection to the reference samples (18) in the socket mount (15) and DUTs (17) in the sample sockets (16). The thermal chuck (13) is configured to thermalize the socket mount (15) and the circuit board (14) to a temperature set point.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3546908B1
source esp@cenet
subjects MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
title ARRANGEMENT AND METHOD FOR CALIBRATING TEMPERATURE SENSORS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T04%3A12%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=De%20Jong,%20Frans&rft.date=2021-05-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3546908B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true