AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS
Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces...
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| creator | DODDS, Shawn C NICCUM, Kayla SHAH, Saagar A CHIU, Jessica METZLER, Thomas J ZHU, James MEYERS, Kara A GOEDDEL, Teresa M STAY, Matthew S KEMLING, Jonathan W SMITH, Matthew R. D PEKUROVSKY, Lyudmila A THEIS, Daniel J LARSEN, Jeremy K PEKUROVSKY, Mikhail L BARTON, Roger W MAHAJAN, Ankit GILMAN, Ann M HERNANDEZ, Joseph E |
| description | Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3542398A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3542398A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3542398A43</originalsourceid><addsrcrecordid>eNrjZLB1DA3x93UM8XRWCHJ19wwOCQKy_f0UnFxDwl1d_RScPYOcQz1DFFw8XYMVHP1cFDz9QlyDnP39_FydQ4J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CxqYmRsaWFo4kxEUoAA2ApzA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS</title><source>esp@cenet</source><creator>DODDS, Shawn C ; NICCUM, Kayla ; SHAH, Saagar A ; CHIU, Jessica ; METZLER, Thomas J ; ZHU, James ; MEYERS, Kara A ; GOEDDEL, Teresa M ; STAY, Matthew S ; KEMLING, Jonathan W ; SMITH, Matthew R. D ; PEKUROVSKY, Lyudmila A ; THEIS, Daniel J ; LARSEN, Jeremy K ; PEKUROVSKY, Mikhail L ; BARTON, Roger W ; MAHAJAN, Ankit ; GILMAN, Ann M ; HERNANDEZ, Joseph E</creator><creatorcontrib>DODDS, Shawn C ; NICCUM, Kayla ; SHAH, Saagar A ; CHIU, Jessica ; METZLER, Thomas J ; ZHU, James ; MEYERS, Kara A ; GOEDDEL, Teresa M ; STAY, Matthew S ; KEMLING, Jonathan W ; SMITH, Matthew R. D ; PEKUROVSKY, Lyudmila A ; THEIS, Daniel J ; LARSEN, Jeremy K ; PEKUROVSKY, Mikhail L ; BARTON, Roger W ; MAHAJAN, Ankit ; GILMAN, Ann M ; HERNANDEZ, Joseph E</creatorcontrib><description>Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201202&DB=EPODOC&CC=EP&NR=3542398A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201202&DB=EPODOC&CC=EP&NR=3542398A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DODDS, Shawn C</creatorcontrib><creatorcontrib>NICCUM, Kayla</creatorcontrib><creatorcontrib>SHAH, Saagar A</creatorcontrib><creatorcontrib>CHIU, Jessica</creatorcontrib><creatorcontrib>METZLER, Thomas J</creatorcontrib><creatorcontrib>ZHU, James</creatorcontrib><creatorcontrib>MEYERS, Kara A</creatorcontrib><creatorcontrib>GOEDDEL, Teresa M</creatorcontrib><creatorcontrib>STAY, Matthew S</creatorcontrib><creatorcontrib>KEMLING, Jonathan W</creatorcontrib><creatorcontrib>SMITH, Matthew R. D</creatorcontrib><creatorcontrib>PEKUROVSKY, Lyudmila A</creatorcontrib><creatorcontrib>THEIS, Daniel J</creatorcontrib><creatorcontrib>LARSEN, Jeremy K</creatorcontrib><creatorcontrib>PEKUROVSKY, Mikhail L</creatorcontrib><creatorcontrib>BARTON, Roger W</creatorcontrib><creatorcontrib>MAHAJAN, Ankit</creatorcontrib><creatorcontrib>GILMAN, Ann M</creatorcontrib><creatorcontrib>HERNANDEZ, Joseph E</creatorcontrib><title>AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS</title><description>Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1DA3x93UM8XRWCHJ19wwOCQKy_f0UnFxDwl1d_RScPYOcQz1DFFw8XYMVHP1cFDz9QlyDnP39_FydQ4J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CxqYmRsaWFo4kxEUoAA2ApzA</recordid><startdate>20201202</startdate><enddate>20201202</enddate><creator>DODDS, Shawn C</creator><creator>NICCUM, Kayla</creator><creator>SHAH, Saagar A</creator><creator>CHIU, Jessica</creator><creator>METZLER, Thomas J</creator><creator>ZHU, James</creator><creator>MEYERS, Kara A</creator><creator>GOEDDEL, Teresa M</creator><creator>STAY, Matthew S</creator><creator>KEMLING, Jonathan W</creator><creator>SMITH, Matthew R. D</creator><creator>PEKUROVSKY, Lyudmila A</creator><creator>THEIS, Daniel J</creator><creator>LARSEN, Jeremy K</creator><creator>PEKUROVSKY, Mikhail L</creator><creator>BARTON, Roger W</creator><creator>MAHAJAN, Ankit</creator><creator>GILMAN, Ann M</creator><creator>HERNANDEZ, Joseph E</creator><scope>EVB</scope></search><sort><creationdate>20201202</creationdate><title>AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS</title><author>DODDS, Shawn C ; NICCUM, Kayla ; SHAH, Saagar A ; CHIU, Jessica ; METZLER, Thomas J ; ZHU, James ; MEYERS, Kara A ; GOEDDEL, Teresa M ; STAY, Matthew S ; KEMLING, Jonathan W ; SMITH, Matthew R. D ; PEKUROVSKY, Lyudmila A ; THEIS, Daniel J ; LARSEN, Jeremy K ; PEKUROVSKY, Mikhail L ; BARTON, Roger W ; MAHAJAN, Ankit ; GILMAN, Ann M ; HERNANDEZ, Joseph E</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3542398A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>DODDS, Shawn C</creatorcontrib><creatorcontrib>NICCUM, Kayla</creatorcontrib><creatorcontrib>SHAH, Saagar A</creatorcontrib><creatorcontrib>CHIU, Jessica</creatorcontrib><creatorcontrib>METZLER, Thomas J</creatorcontrib><creatorcontrib>ZHU, James</creatorcontrib><creatorcontrib>MEYERS, Kara A</creatorcontrib><creatorcontrib>GOEDDEL, Teresa M</creatorcontrib><creatorcontrib>STAY, Matthew S</creatorcontrib><creatorcontrib>KEMLING, Jonathan W</creatorcontrib><creatorcontrib>SMITH, Matthew R. D</creatorcontrib><creatorcontrib>PEKUROVSKY, Lyudmila A</creatorcontrib><creatorcontrib>THEIS, Daniel J</creatorcontrib><creatorcontrib>LARSEN, Jeremy K</creatorcontrib><creatorcontrib>PEKUROVSKY, Mikhail L</creatorcontrib><creatorcontrib>BARTON, Roger W</creatorcontrib><creatorcontrib>MAHAJAN, Ankit</creatorcontrib><creatorcontrib>GILMAN, Ann M</creatorcontrib><creatorcontrib>HERNANDEZ, Joseph E</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DODDS, Shawn C</au><au>NICCUM, Kayla</au><au>SHAH, Saagar A</au><au>CHIU, Jessica</au><au>METZLER, Thomas J</au><au>ZHU, James</au><au>MEYERS, Kara A</au><au>GOEDDEL, Teresa M</au><au>STAY, Matthew S</au><au>KEMLING, Jonathan W</au><au>SMITH, Matthew R. D</au><au>PEKUROVSKY, Lyudmila A</au><au>THEIS, Daniel J</au><au>LARSEN, Jeremy K</au><au>PEKUROVSKY, Mikhail L</au><au>BARTON, Roger W</au><au>MAHAJAN, Ankit</au><au>GILMAN, Ann M</au><au>HERNANDEZ, Joseph E</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS</title><date>2020-12-02</date><risdate>2020</risdate><abstract>Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS |
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