SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE

A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be me...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CALTABIANO, Daniele, GHIDONI, Marco Omar, ABBASI GAVARTI, Mohammad
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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