EXAMINATION DEVICE, EXAMINATION METHOD, COMPUTER PROGRAM, AND RECORDING MEDIUM

EXAMINATION DEVICE, EXAMINATION METHOD, COMPUTER PROGRAM, AND RECORDING MEDIUM

An inspection apparatus 100 is provided with: an irradiating device 110 configured to irradiate a sample S in which a plurality of layers L are laminated with a terahertz wave THz; a detecting device 130 configured to detect the terahertz wave from the sample to obtain a detected waveform DW; and an...

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Hauptverfasser: OCHIAI, Takanori, OGASAWARA, Masakazu
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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creator OCHIAI, Takanori
OGASAWARA, Masakazu
description An inspection apparatus 100 is provided with: an irradiating device 110 configured to irradiate a sample S in which a plurality of layers L are laminated with a terahertz wave THz; a detecting device 130 configured to detect the terahertz wave from the sample to obtain a detected waveform DW; and an estimating device 1523 configured to estimate a position of a first boundary surface on the basis of a second boundary surface pulse wave PW2 and a library 1522a, the second boundary surface pulse wave appearing in the detected waveform to correspond to a second boundary surface B2 that is farther from an outer surface B0 than the first boundary surface B1, the library representing an estimated waveform EW of the terahertz wave from the sample.
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
title EXAMINATION DEVICE, EXAMINATION METHOD, COMPUTER PROGRAM, AND RECORDING MEDIUM
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