COMPACT LIQUID COOLING MODULE FOR AN IT SERVER

Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a...

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Hauptverfasser: BONNIN, Jean-Christophe, ZEKRI, Elyès
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Sprache:eng ; fre ; ger
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creator BONNIN, Jean-Christophe
ZEKRI, Elyès
description Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3524045B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3524045B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3524045B13</originalsourceid><addsrcrecordid>eNrjZNBz9vcNcHQOUfDxDAz1dFFw9vf38fRzV_D1dwn1cVVw8w9ScPRT8AxRCHYNCnMN4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxqZGJgYmpk6GxkQoAQCDOSUX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMPACT LIQUID COOLING MODULE FOR AN IT SERVER</title><source>esp@cenet</source><creator>BONNIN, Jean-Christophe ; ZEKRI, Elyès</creator><creatorcontrib>BONNIN, Jean-Christophe ; ZEKRI, Elyès</creatorcontrib><description>Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220706&amp;DB=EPODOC&amp;CC=EP&amp;NR=3524045B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220706&amp;DB=EPODOC&amp;CC=EP&amp;NR=3524045B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BONNIN, Jean-Christophe</creatorcontrib><creatorcontrib>ZEKRI, Elyès</creatorcontrib><title>COMPACT LIQUID COOLING MODULE FOR AN IT SERVER</title><description>Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBz9vcNcHQOUfDxDAz1dFFw9vf38fRzV_D1dwn1cVVw8w9ScPRT8AxRCHYNCnMN4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxqZGJgYmpk6GxkQoAQCDOSUX</recordid><startdate>20220706</startdate><enddate>20220706</enddate><creator>BONNIN, Jean-Christophe</creator><creator>ZEKRI, Elyès</creator><scope>EVB</scope></search><sort><creationdate>20220706</creationdate><title>COMPACT LIQUID COOLING MODULE FOR AN IT SERVER</title><author>BONNIN, Jean-Christophe ; ZEKRI, Elyès</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3524045B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>BONNIN, Jean-Christophe</creatorcontrib><creatorcontrib>ZEKRI, Elyès</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BONNIN, Jean-Christophe</au><au>ZEKRI, Elyès</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPACT LIQUID COOLING MODULE FOR AN IT SERVER</title><date>2022-07-06</date><risdate>2022</risdate><abstract>Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title COMPACT LIQUID COOLING MODULE FOR AN IT SERVER
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T22%3A33%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BONNIN,%20Jean-Christophe&rft.date=2022-07-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3524045B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true