QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME
The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and...
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| creator | HAHN, Jung Seok WANG, Younseon HWANG, Hong Gu LEE, Haeshin |
| description | The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3521372B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3521372B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3521372B13</originalsourceid><addsrcrecordid>eNrjZHALDPX08_dzVXAODXJ08gHS_r4B_sGeIZ7-fsEKjn4uCo4uHq7BnmFoMiBOkGewp5-7QrCjrysPA2taYk5xKi-U5mZQcHMNcfbQTS3Ij08tLkhMTs1LLYl3DTA2NTI0NjdyMjQmQgkAi1IsTQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME</title><source>esp@cenet</source><creator>HAHN, Jung Seok ; WANG, Younseon ; HWANG, Hong Gu ; LEE, Haeshin</creator><creatorcontrib>HAHN, Jung Seok ; WANG, Younseon ; HWANG, Hong Gu ; LEE, Haeshin</creatorcontrib><description>The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230802&DB=EPODOC&CC=EP&NR=3521372B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230802&DB=EPODOC&CC=EP&NR=3521372B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAHN, Jung Seok</creatorcontrib><creatorcontrib>WANG, Younseon</creatorcontrib><creatorcontrib>HWANG, Hong Gu</creatorcontrib><creatorcontrib>LEE, Haeshin</creatorcontrib><title>QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME</title><description>The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALDPX08_dzVXAODXJ08gHS_r4B_sGeIZ7-fsEKjn4uCo4uHq7BnmFoMiBOkGewp5-7QrCjrysPA2taYk5xKi-U5mZQcHMNcfbQTS3Ij08tLkhMTs1LLYl3DTA2NTI0NjdyMjQmQgkAi1IsTQ</recordid><startdate>20230802</startdate><enddate>20230802</enddate><creator>HAHN, Jung Seok</creator><creator>WANG, Younseon</creator><creator>HWANG, Hong Gu</creator><creator>LEE, Haeshin</creator><scope>EVB</scope></search><sort><creationdate>20230802</creationdate><title>QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME</title><author>HAHN, Jung Seok ; WANG, Younseon ; HWANG, Hong Gu ; LEE, Haeshin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3521372B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HAHN, Jung Seok</creatorcontrib><creatorcontrib>WANG, Younseon</creatorcontrib><creatorcontrib>HWANG, Hong Gu</creatorcontrib><creatorcontrib>LEE, Haeshin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAHN, Jung Seok</au><au>WANG, Younseon</au><au>HWANG, Hong Gu</au><au>LEE, Haeshin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME</title><date>2023-08-02</date><risdate>2023</risdate><abstract>The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
| title | QUINONE CURABLE COMPOSITIONS AND ADHESIVE COMPOSITIONS COMPRISING SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T05%3A36%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HAHN,%20Jung%20Seok&rft.date=2023-08-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3521372B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |