LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | DOGEN Ryota TOYAMA Kyoko FUKUI Hiroshi USHIO Yoshito |
| description | Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components and the like before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Further, it is an object of the present invention to provide a method for manufacturing an electronic component in which the use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component.Solution: A laminate including a curing reactive silicone gel layer on at least one type of substrate and its use. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3517292A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3517292A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3517292A43</originalsourceid><addsrcrecordid>eNrjZIjwcfT19HMMcdVR8HX0C3VzdA4JDfL0c1fwdQ3x8HdRCPFwDXL1d9NRcPRzwa7C303B1cfVOSTI38_TWcHZ3zfA38_VL4SHgTUtMac4lRdKczMouLmGOHvophbkx6cWFyQmp-allsS7BhibGpobWRo5mhgToQQAjr0w5A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT</title><source>esp@cenet</source><creator>DOGEN Ryota ; TOYAMA Kyoko ; FUKUI Hiroshi ; USHIO Yoshito</creator><creatorcontrib>DOGEN Ryota ; TOYAMA Kyoko ; FUKUI Hiroshi ; USHIO Yoshito</creatorcontrib><description>Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components and the like before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Further, it is an object of the present invention to provide a method for manufacturing an electronic component in which the use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component.Solution: A laminate including a curing reactive silicone gel layer on at least one type of substrate and its use.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200520&DB=EPODOC&CC=EP&NR=3517292A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200520&DB=EPODOC&CC=EP&NR=3517292A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOGEN Ryota</creatorcontrib><creatorcontrib>TOYAMA Kyoko</creatorcontrib><creatorcontrib>FUKUI Hiroshi</creatorcontrib><creatorcontrib>USHIO Yoshito</creatorcontrib><title>LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT</title><description>Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components and the like before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Further, it is an object of the present invention to provide a method for manufacturing an electronic component in which the use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component.Solution: A laminate including a curing reactive silicone gel layer on at least one type of substrate and its use.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjwcfT19HMMcdVR8HX0C3VzdA4JDfL0c1fwdQ3x8HdRCPFwDXL1d9NRcPRzwa7C303B1cfVOSTI38_TWcHZ3zfA38_VL4SHgTUtMac4lRdKczMouLmGOHvophbkx6cWFyQmp-allsS7BhibGpobWRo5mhgToQQAjr0w5A</recordid><startdate>20200520</startdate><enddate>20200520</enddate><creator>DOGEN Ryota</creator><creator>TOYAMA Kyoko</creator><creator>FUKUI Hiroshi</creator><creator>USHIO Yoshito</creator><scope>EVB</scope></search><sort><creationdate>20200520</creationdate><title>LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT</title><author>DOGEN Ryota ; TOYAMA Kyoko ; FUKUI Hiroshi ; USHIO Yoshito</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3517292A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>DOGEN Ryota</creatorcontrib><creatorcontrib>TOYAMA Kyoko</creatorcontrib><creatorcontrib>FUKUI Hiroshi</creatorcontrib><creatorcontrib>USHIO Yoshito</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DOGEN Ryota</au><au>TOYAMA Kyoko</au><au>FUKUI Hiroshi</au><au>USHIO Yoshito</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT</title><date>2020-05-20</date><risdate>2020</risdate><abstract>Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components and the like before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Further, it is an object of the present invention to provide a method for manufacturing an electronic component in which the use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component.Solution: A laminate including a curing reactive silicone gel layer on at least one type of substrate and its use.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3517292A4 |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T03%3A48%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DOGEN%20Ryota&rft.date=2020-05-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3517292A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |