BONDING SUBSTRATE SURFACE DEFECT EVALUATION METHOD

The present invention provides a method for evaluating surface defects of a substrate to be bonded, including the steps of: preparing a mirror-polished silicon single crystal substrate; inspecting surface defects on the mirror-polished silicon single crystal substrate; depositing a polycrystalline s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HASHIMOTO, Hiromasa, NISHIZAWA, Tsuyoshi, HORIE, Hirotaka, SATO, Kazuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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