ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME
Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole...
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| creator | SHOREY, Aric, Bruce JIN, Yuhui LEVESQUE, Daniel, Wayne, Jr PIECH, Garrett, Andrew COVARRUBIAS JARAMILLO, Andres KUKSENKOVA, Ekaterina Aleksandrovna KRAMER, Frank, Andrew, IV WAGNER, Robert, Stephen |
| description | Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3510002A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3510002A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3510002A13</originalsourceid><addsrcrecordid>eNrjZAh1DArxdPZxDVbwcAzz9HNX8PAHccI9QzwUfP2DAoBcf_dIBceQkCBPp9AQoJSjn4uCr2uIh79LsIKbf5CCm6NTkKezYwhIc4iHq0Kwo68rDwNrWmJOcSovlOZmUHBzDXH20E0tyI9PLS5ITE7NSy2Jdw0wNjU0MDAwcjQ0JkIJAAyLL-s</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME</title><source>esp@cenet</source><creator>SHOREY, Aric, Bruce ; JIN, Yuhui ; LEVESQUE, Daniel, Wayne, Jr ; PIECH, Garrett, Andrew ; COVARRUBIAS JARAMILLO, Andres ; KUKSENKOVA, Ekaterina Aleksandrovna ; KRAMER, Frank, Andrew, IV ; WAGNER, Robert, Stephen</creator><creatorcontrib>SHOREY, Aric, Bruce ; JIN, Yuhui ; LEVESQUE, Daniel, Wayne, Jr ; PIECH, Garrett, Andrew ; COVARRUBIAS JARAMILLO, Andres ; KUKSENKOVA, Ekaterina Aleksandrovna ; KRAMER, Frank, Andrew, IV ; WAGNER, Robert, Stephen</creatorcontrib><description>Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190717&DB=EPODOC&CC=EP&NR=3510002A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190717&DB=EPODOC&CC=EP&NR=3510002A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHOREY, Aric, Bruce</creatorcontrib><creatorcontrib>JIN, Yuhui</creatorcontrib><creatorcontrib>LEVESQUE, Daniel, Wayne, Jr</creatorcontrib><creatorcontrib>PIECH, Garrett, Andrew</creatorcontrib><creatorcontrib>COVARRUBIAS JARAMILLO, Andres</creatorcontrib><creatorcontrib>KUKSENKOVA, Ekaterina Aleksandrovna</creatorcontrib><creatorcontrib>KRAMER, Frank, Andrew, IV</creatorcontrib><creatorcontrib>WAGNER, Robert, Stephen</creatorcontrib><title>ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME</title><description>Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh1DArxdPZxDVbwcAzz9HNX8PAHccI9QzwUfP2DAoBcf_dIBceQkCBPp9AQoJSjn4uCr2uIh79LsIKbf5CCm6NTkKezYwhIc4iHq0Kwo68rDwNrWmJOcSovlOZmUHBzDXH20E0tyI9PLS5ITE7NSy2Jdw0wNjU0MDAwcjQ0JkIJAAyLL-s</recordid><startdate>20190717</startdate><enddate>20190717</enddate><creator>SHOREY, Aric, Bruce</creator><creator>JIN, Yuhui</creator><creator>LEVESQUE, Daniel, Wayne, Jr</creator><creator>PIECH, Garrett, Andrew</creator><creator>COVARRUBIAS JARAMILLO, Andres</creator><creator>KUKSENKOVA, Ekaterina Aleksandrovna</creator><creator>KRAMER, Frank, Andrew, IV</creator><creator>WAGNER, Robert, Stephen</creator><scope>EVB</scope></search><sort><creationdate>20190717</creationdate><title>ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME</title><author>SHOREY, Aric, Bruce ; JIN, Yuhui ; LEVESQUE, Daniel, Wayne, Jr ; PIECH, Garrett, Andrew ; COVARRUBIAS JARAMILLO, Andres ; KUKSENKOVA, Ekaterina Aleksandrovna ; KRAMER, Frank, Andrew, IV ; WAGNER, Robert, Stephen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3510002A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SHOREY, Aric, Bruce</creatorcontrib><creatorcontrib>JIN, Yuhui</creatorcontrib><creatorcontrib>LEVESQUE, Daniel, Wayne, Jr</creatorcontrib><creatorcontrib>PIECH, Garrett, Andrew</creatorcontrib><creatorcontrib>COVARRUBIAS JARAMILLO, Andres</creatorcontrib><creatorcontrib>KUKSENKOVA, Ekaterina Aleksandrovna</creatorcontrib><creatorcontrib>KRAMER, Frank, Andrew, IV</creatorcontrib><creatorcontrib>WAGNER, Robert, Stephen</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHOREY, Aric, Bruce</au><au>JIN, Yuhui</au><au>LEVESQUE, Daniel, Wayne, Jr</au><au>PIECH, Garrett, Andrew</au><au>COVARRUBIAS JARAMILLO, Andres</au><au>KUKSENKOVA, Ekaterina Aleksandrovna</au><au>KRAMER, Frank, Andrew, IV</au><au>WAGNER, Robert, Stephen</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME</title><date>2019-07-17</date><risdate>2019</risdate><abstract>Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | ARTICLES HAVING HOLES WITH MORPHOLOGY ATTRIBUTES AND METHODS FOR FABRICATING THE SAME |
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