BONDING BODY, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
This bonding body is provided with a ceramic member and a copper member bonded to the ceramic member via a bonding layer. The nano-indentation hardness HIT of the bonding layer is 1.0-2.5 GPa inclusive.
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| creator | UMEHARA Masashi NABA Takayuki KATO Hiromasa |
| description | This bonding body is provided with a ceramic member and a copper member bonded to the ceramic member via a bonding layer. The nano-indentation hardness HIT of the bonding layer is 1.0-2.5 GPa inclusive. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE |
| title | BONDING BODY, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE |
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