DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING

A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The depo...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LIFKA, Herbert
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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