DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING
A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The depo...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LIFKA, Herbert |
| description | A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3485060A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3485060A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3485060A13</originalsourceid><addsrcrecordid>eNrjZDBwcQ3wD_YM8fT3U3AMCnL0c3f1dfULUXD0c1HwdQ3x8HdRcPMPUoCp8nPnYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGJhamBmYGjobGRCgBAO8pJfY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><source>esp@cenet</source><creator>LIFKA, Herbert</creator><creatorcontrib>LIFKA, Herbert</creatorcontrib><description>A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).</description><language>eng ; fre ; ger</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190522&DB=EPODOC&CC=EP&NR=3485060A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25571,76555</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190522&DB=EPODOC&CC=EP&NR=3485060A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIFKA, Herbert</creatorcontrib><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><description>A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBwcQ3wD_YM8fT3U3AMCnL0c3f1dfULUXD0c1HwdQ3x8HdRcPMPUoCp8nPnYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGJhamBmYGjobGRCgBAO8pJfY</recordid><startdate>20190522</startdate><enddate>20190522</enddate><creator>LIFKA, Herbert</creator><scope>EVB</scope></search><sort><creationdate>20190522</creationdate><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><author>LIFKA, Herbert</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3485060A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>LIFKA, Herbert</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIFKA, Herbert</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING</title><date>2019-05-22</date><risdate>2019</risdate><abstract>A deposition arrangement (1) is provided for depositing a substance (SB) on a substrate surface (ST1) of a substrate (ST). The deposition arrangement comprises a deposition source (20) and a deposition mask (30) that is arranged between the deposition source (20) and the deposition surface. The deposition mask (30) has a first mask surface (38) facing the deposition source and a second mask surface (39) facing the substrate surface (ST1). The deposition mask (30) is provided with a spatial pattern defined by at least one closed area (34) and at least one perforated area (36) defined by a plurality of through holes (37) and wherein a substrate carrier (10) is provided to carry the substrate with its substrate surface (ST1) at distance (D) from the second mask surface (39).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3485060A1 |
| source | esp@cenet |
| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | DEPOSITION ARRANGEMENT AND METHOD FOR DEPOSITING |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-05T16%3A26%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIFKA,%20Herbert&rft.date=2019-05-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3485060A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |