INTEGRATED CIRCUIT PACKAGE STACK

Apparatuses, methods and systems associated with integrated circuit (IC) package design are disclosed herein. An IC package stack may include a first IC package and a second IC package. The first IC package may include a first die and a first redistribution layer that communicatively couples contact...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MEKONNEN, Yidnekachew S, GUZEK, John S, JAYARAMAN, Saikumar
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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