INTEGRATED CIRCUIT PACKAGE STACK

INTEGRATED CIRCUIT PACKAGE STACK

Apparatuses, methods and systems associated with integrated circuit (IC) package design are disclosed herein. An IC package stack may include a first IC package and a second IC package. The first IC package may include a first die and a first redistribution layer that communicatively couples contact...

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Hauptverfasser: MEKONNEN, Yidnekachew S, GUZEK, John S, JAYARAMAN, Saikumar
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MEKONNEN, Yidnekachew S
GUZEK, John S
JAYARAMAN, Saikumar
description Apparatuses, methods and systems associated with integrated circuit (IC) package design are disclosed herein. An IC package stack may include a first IC package and a second IC package. The first IC package may include a first die and a first redistribution layer that communicatively couples contacts on the first side of the first IC package to the first die and to contacts on a second side of the first IC package, the second side opposite to the first side. The second IC package may be mounted to the second side of the first IC package. The second IC package may include a second die and a second redistribution layer that communicatively couples contacts on a side of the second IC package to the second die, the contacts of the second IC package communicatively coupled to the contacts on the second side of the first IC package.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title INTEGRATED CIRCUIT PACKAGE STACK
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