ELECTRONIC UNIT AND METHOD FOR MANUFACTURING AN ELECTRONIC UNIT
The invention relates to an electronic unit (100, 100′) comprising at least one printed circuit board (10, 10′, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housin...
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creator | DOEHREN, Stefan WIESA, Thomas HENNEL, Udo |
description | The invention relates to an electronic unit (100, 100′) comprising at least one printed circuit board (10, 10′, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80′). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80′). |
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In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80′).</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190501&DB=EPODOC&CC=EP&NR=3476186A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190501&DB=EPODOC&CC=EP&NR=3476186A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOEHREN, Stefan</creatorcontrib><creatorcontrib>WIESA, Thomas</creatorcontrib><creatorcontrib>HENNEL, Udo</creatorcontrib><title>ELECTRONIC UNIT AND METHOD FOR MANUFACTURING AN ELECTRONIC UNIT</title><description>The invention relates to an electronic unit (100, 100′) comprising at least one printed circuit board (10, 10′, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80′). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80′).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB39XF1Dgny9_N0Vgj18wxRcPRzUfB1DfHwd1Fw8w9S8HX0C3VzdA4JDfL0cwdKKqCp52FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxibmZoYWZo6GxkQoAQAr1ioC</recordid><startdate>20190501</startdate><enddate>20190501</enddate><creator>DOEHREN, Stefan</creator><creator>WIESA, Thomas</creator><creator>HENNEL, Udo</creator><scope>EVB</scope></search><sort><creationdate>20190501</creationdate><title>ELECTRONIC UNIT AND METHOD FOR MANUFACTURING AN ELECTRONIC UNIT</title><author>DOEHREN, Stefan ; WIESA, Thomas ; HENNEL, Udo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3476186A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>DOEHREN, Stefan</creatorcontrib><creatorcontrib>WIESA, Thomas</creatorcontrib><creatorcontrib>HENNEL, Udo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DOEHREN, Stefan</au><au>WIESA, Thomas</au><au>HENNEL, Udo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC UNIT AND METHOD FOR MANUFACTURING AN ELECTRONIC UNIT</title><date>2019-05-01</date><risdate>2019</risdate><abstract>The invention relates to an electronic unit (100, 100′) comprising at least one printed circuit board (10, 10′, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80′). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80′).</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | ELECTRONIC UNIT AND METHOD FOR MANUFACTURING AN ELECTRONIC UNIT |
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