A PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

In a general aspect, an apparatus can include a package including a common gate conductor, a first silicon carbide die having a die gate conductor, and a second silicon carbide die having a die gate conductor. The apparatus can include a first conductive path between the common gate conductor and th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TEYSSEYRE, Jerome, ESTACIO, Maria Cristina, IM, Seungwon
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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