APPARATUS FOR PROCESSING A SEMICONDUCTOR DEVICE
The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation...
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| creator | Ding, Jiapei Yan, Kar Weng Liao, Jian Mouleeswaran, Deivasigamani Yuan, Bin Song, Keng Yew Kuah, Teng Hock |
| description | The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion. The spacer also comprises a second portion distal from the pressure application component, wherein in the coupled state, the second portion is proximate the semiconductor device and is operable to transmit the force from the pressure application component to the semiconductor device as a second pressure. |
| format | Patent |
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A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion. The spacer also comprises a second portion distal from the pressure application component, wherein in the coupled state, the second portion is proximate the semiconductor device and is operable to transmit the force from the pressure application component to the semiconductor device as a second pressure.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220608&DB=EPODOC&CC=EP&NR=3454364B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220608&DB=EPODOC&CC=EP&NR=3454364B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ding, Jiapei</creatorcontrib><creatorcontrib>Yan, Kar Weng</creatorcontrib><creatorcontrib>Liao, Jian</creatorcontrib><creatorcontrib>Mouleeswaran, Deivasigamani</creatorcontrib><creatorcontrib>Yuan, Bin</creatorcontrib><creatorcontrib>Song, Keng Yew</creatorcontrib><creatorcontrib>Kuah, Teng Hock</creatorcontrib><title>APPARATUS FOR PROCESSING A SEMICONDUCTOR DEVICE</title><description>The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion. The spacer also comprises a second portion distal from the pressure application component, wherein in the coupled state, the second portion is proximate the semiconductor device and is operable to transmit the force from the pressure application component to the semiconductor device as a second pressure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB3DAhwDHIMCQ1WcPMPUggI8nd2DQ729HNXcFQIdvX1dPb3cwl1DgFKubiGeTq78jCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAYxNTE2MzEydDYyKUAADNwiW_</recordid><startdate>20220608</startdate><enddate>20220608</enddate><creator>Ding, Jiapei</creator><creator>Yan, Kar Weng</creator><creator>Liao, Jian</creator><creator>Mouleeswaran, Deivasigamani</creator><creator>Yuan, Bin</creator><creator>Song, Keng Yew</creator><creator>Kuah, Teng Hock</creator><scope>EVB</scope></search><sort><creationdate>20220608</creationdate><title>APPARATUS FOR PROCESSING A SEMICONDUCTOR DEVICE</title><author>Ding, Jiapei ; Yan, Kar Weng ; Liao, Jian ; Mouleeswaran, Deivasigamani ; Yuan, Bin ; Song, Keng Yew ; Kuah, Teng Hock</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3454364B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ding, Jiapei</creatorcontrib><creatorcontrib>Yan, Kar Weng</creatorcontrib><creatorcontrib>Liao, Jian</creatorcontrib><creatorcontrib>Mouleeswaran, Deivasigamani</creatorcontrib><creatorcontrib>Yuan, Bin</creatorcontrib><creatorcontrib>Song, Keng Yew</creatorcontrib><creatorcontrib>Kuah, Teng Hock</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ding, Jiapei</au><au>Yan, Kar Weng</au><au>Liao, Jian</au><au>Mouleeswaran, Deivasigamani</au><au>Yuan, Bin</au><au>Song, Keng Yew</au><au>Kuah, Teng Hock</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR PROCESSING A SEMICONDUCTOR DEVICE</title><date>2022-06-08</date><risdate>2022</risdate><abstract>The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion. The spacer also comprises a second portion distal from the pressure application component, wherein in the coupled state, the second portion is proximate the semiconductor device and is operable to transmit the force from the pressure application component to the semiconductor device as a second pressure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | APPARATUS FOR PROCESSING A SEMICONDUCTOR DEVICE |
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