WATER VAPOR-BLOCKING ADHESIVE COMPOUND HAVING HIGHLY FUNCTIONALIZED POLY(METH)ACRYLATE

Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the cura...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KUPSKY, Marco, DOLLASE, Thilo, GARGIULO, Jessika, WEDEL, Bastian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.