LASER CUTTING AND REMOVAL OF CONTOURED SHAPES FROM TRANSPARENT SUBSTRATES

A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation o...

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Hauptverfasser:	GUO, Xiaoju, BOWDEN, Bradley Frederick, WIELAND, Kristopher Allen, HACKERT, Thomas, PIECH, Garrett Andrew
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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creator	GUO, Xiaoju BOWDEN, Bradley Frederick WIELAND, Kristopher Allen HACKERT, Thomas PIECH, Garrett Andrew
description	A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.
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language	eng ; fre ; ger
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subjects	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	LASER CUTTING AND REMOVAL OF CONTOURED SHAPES FROM TRANSPARENT SUBSTRATES
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