ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including: a first leadframe portion including a first plurality of signal leads; and a second leadframe portion including a se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bartolo, Marlon, Estacio, Maria Cristina, Quinones, Maria Clemens Ypil, Wu, Chung-Lin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!