HEAT SPREADER

HEAT SPREADER

In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed...

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Hauptverfasser: SOINI, Sakari, MÄÄTTÄ, Esa
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SOINI, Sakari
MÄÄTTÄ, Esa
description In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.
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In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190220&amp;DB=EPODOC&amp;CC=EP&amp;NR=3443590A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190220&amp;DB=EPODOC&amp;CC=EP&amp;NR=3443590A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SOINI, Sakari</creatorcontrib><creatorcontrib>MÄÄTTÄ, Esa</creatorcontrib><title>HEAT SPREADER</title><description>In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD1cHUMUQgOCHJ1dHEN4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxiYmxqaWBo6GxkQoAQBspRws</recordid><startdate>20190220</startdate><enddate>20190220</enddate><creator>SOINI, Sakari</creator><creator>MÄÄTTÄ, Esa</creator><scope>EVB</scope></search><sort><creationdate>20190220</creationdate><title>HEAT SPREADER</title><author>SOINI, Sakari ; MÄÄTTÄ, Esa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3443590A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SOINI, Sakari</creatorcontrib><creatorcontrib>MÄÄTTÄ, Esa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SOINI, Sakari</au><au>MÄÄTTÄ, Esa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT SPREADER</title><date>2019-02-20</date><risdate>2019</risdate><abstract>In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HEAT SPREADER
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