METHOD OF PROCESSING A COMPONENT, EXHAUST NOZZLE AND SYSTEM TO LASER CLEARANCE OF COATING

Aspects of the disclosure are directed to processing a component (300d). A first coating is removed from a substrate (304) of the component (300d), the substrate (304) including a first hole (316a). Subsequent to removing the first coating from the substrate (304), a second coating (310') is ap...

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Bibliographische Detailangaben
Hauptverfasser:	REED, Gordon M, POTTER, David N
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ENGINE PLANTS IN GENERAL HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MACHINE TOOLS MACHINES OR ENGINES IN GENERAL MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES PERFORMING OPERATIONS SOLDERING OR UNSOLDERING STEAM ENGINES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Aspects of the disclosure are directed to processing a component (300d). A first coating is removed from a substrate (304) of the component (300d), the substrate (304) including a first hole (316a). Subsequent to removing the first coating from the substrate (304), a second coating (310') is applied to the substrate (304), where a portion of the second coating (310') at least partially blocks the first hole (316a). Subsequent to applying the second coating (310') to the substrate (304), the portion of the second coating (310') is removed to generate a second hole (316b') through the second coating (310'). The removal of the portion of the second coating (310') crea tes a bore in the second coating (310') that provides a clearance from an edge (328) of the first hole (316a) on a surface of the substrate (304) that interfaces to the second coating (310').