COOLING DEVICE

A cooling device 10 may be configured to cool a shape-memory alloy member. The cooling device 10 may include: a cooling unit 20 configured to cool the shape-memory alloy member or a part that is to make contact with the shape-memory alloy member; a refrigerant supply pipe 30, 31 including one end co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IKEDA Tetsuo, YOSHIMI Yukiharu, KAWAI Hirohisa
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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