COMPONENT CARRIER WITH INTEGRATED WALL STRUCTURE FOR SUBSEQUENT ASSEMBLY OF AN ELECTRONIC COMPONENT

A method of manufacturing an electronic device includes providing a component carrier having a laminate of at least one electrically conductive layer structure and at least one electrically insulating layer structure, providing a mounting base for mounting an electronic component on and/or in the co...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MOITZI, Heinz
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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