PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

A microelectronic package comprising: a substrate (12) having first (18) and second (20) regions, the substrate having a first surface (14) and a remote second surface (16) ; at least one microelectronic element (22) overlying the first surface within the first region; electrically conductive elemen...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, Wei-shun, CO, Reynaldo, YANG, Se Young, ZHAO, Zhijun, ALATORRE, Roseann, CHAU, Ellis, DAMBERG, Philip
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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