HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD

A highly conductive transparent glass-based circuit board includes a glass substrate (1). The glass substrate (1) is a glass-tempered substrate. A surface of the glass-tempered substrate faces air. A conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit (2) fused with the surface of the glass-tempered substrate. The surface of the glass-tempered substrate and an upper surface of the conductive circuit (2) are at the same level. A surface of the conductive circuit (2), except a region reserved for a solder pad (3) used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer (4). The conductive circuit (2) is tightly fused with the glass substrate (1). It is a fusional relation between the conductive circuit (2) and the glass substrate (1). A surface of the glass substrate (1) and an upper surface of the conductive circuit (2) are at the same level. Because a surface of the highly conductive transparent glass-based circuit board is smooth, the conductive circuit (2) is not easily damaged. The highly conductive transparent glass-based circuit board has the characteristics of high conductivity and high transmittance.