POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAKAMURA, Tadamitsu
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NAKAMURA, Tadamitsu
description A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, -O-, or -SO 2 -, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R 1 is independently a hydrogen atom or a group represented by -CH 2 -O-R 2 . At least one of the plurality of R 1 s is a group represented by -CH 2 -O-R 2 . R 2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3413131A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3413131A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3413131A13</originalsourceid><addsrcrecordid>eNrjZNAL8A_2DPEMc9UNiQxwVQjw8A_xD3b1g4gpBLkGe_opOPv7QlT5-_EwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGMTQ2MgdDQ0JkIJAOhBJfg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION</title><source>esp@cenet</source><creator>NAKAMURA, Tadamitsu</creator><creatorcontrib>NAKAMURA, Tadamitsu</creatorcontrib><description>A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, -O-, or -SO 2 -, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R 1 is independently a hydrogen atom or a group represented by -CH 2 -O-R 2 . At least one of the plurality of R 1 s is a group represented by -CH 2 -O-R 2 . R 2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181212&amp;DB=EPODOC&amp;CC=EP&amp;NR=3413131A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181212&amp;DB=EPODOC&amp;CC=EP&amp;NR=3413131A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAMURA, Tadamitsu</creatorcontrib><title>POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION</title><description>A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, -O-, or -SO 2 -, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R 1 is independently a hydrogen atom or a group represented by -CH 2 -O-R 2 . At least one of the plurality of R 1 s is a group represented by -CH 2 -O-R 2 . R 2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAL8A_2DPEMc9UNiQxwVQjw8A_xD3b1g4gpBLkGe_opOPv7QlT5-_EwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGMTQ2MgdDQ0JkIJAOhBJfg</recordid><startdate>20181212</startdate><enddate>20181212</enddate><creator>NAKAMURA, Tadamitsu</creator><scope>EVB</scope></search><sort><creationdate>20181212</creationdate><title>POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION</title><author>NAKAMURA, Tadamitsu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3413131A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAMURA, Tadamitsu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAMURA, Tadamitsu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION</title><date>2018-12-12</date><risdate>2018</risdate><abstract>A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, -O-, or -SO 2 -, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R 1 is independently a hydrogen atom or a group represented by -CH 2 -O-R 2 . At least one of the plurality of R 1 s is a group represented by -CH 2 -O-R 2 . R 2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3413131A1
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T20%3A43%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAMURA,%20Tadamitsu&rft.date=2018-12-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3413131A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true