STRUCTURAL MODULE ASSEMBLY HAVING OVERMOLDED ELECTRICALLY CONDUCTIVE REINFORCEMENTS

STRUCTURAL MODULE ASSEMBLY HAVING OVERMOLDED ELECTRICALLY CONDUCTIVE REINFORCEMENTS

A structural module assembly with conductive reinforcements overmolded within the plastic and/or composite subassembly as a main power bus and a communication bus for electrical components assembled onto the module. Control signals are either transmitted between a main microcontroller and another mi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GRGAC, Steven, GRELLA, Philip
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
MOTOR VEHICLES
PERFORMING OPERATIONS
TRAILERS
TRANSPORTING
VEHICLES IN GENERAL
VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR
WIRELESS COMMUNICATIONS NETWORKS
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Beschreibung
Zusammenfassung:A structural module assembly with conductive reinforcements overmolded within the plastic and/or composite subassembly as a main power bus and a communication bus for electrical components assembled onto the module. Control signals are either transmitted between a main microcontroller and another microcontroller by way of the communication bus or wirelessly. The microcontrollers determine which electrical components to activate, and power is provided to the electrical components by way of the main power bus.