MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF

Multi-layer printed circuit boards and methods of producing the same are disclosed. In one example, a multi-layer printed circuit board may include flat coils which are situated vertically one above the other and are connected electrically in series or in parallel in order to form a first solenoid c...

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Bibliographische Detailangaben
1. Verfasser: KEGELER, Jörg
Format: Patent
Sprache:eng ; fre ; ger
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