MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF

Multi-layer printed circuit boards and methods of producing the same are disclosed. In one example, a multi-layer printed circuit board may include flat coils which are situated vertically one above the other and are connected electrically in series or in parallel in order to form a first solenoid c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KEGELER, Jörg
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KEGELER, Jörg
description Multi-layer printed circuit boards and methods of producing the same are disclosed. In one example, a multi-layer printed circuit board may include flat coils which are situated vertically one above the other and are connected electrically in series or in parallel in order to form a first solenoid coil. Two vertically adjacent flat coils may be arranged laterally offset in relation to one another in such a way that conductor track sections of one flat coil are arranged so as to vertically partially overlap with two conductor track sections of the other flat coil in a cross section perpendicular to a surface of the multi-layer printed circuit board.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3375261A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3375261A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3375261A13</originalsourceid><addsrcrecordid>eNqNirEKwjAQQLM4iPoP9wMdalDnmFzNQZor4SI4SCkSJ9FC_X9UEFydHo_35urc5iBUBXPCBF2iKOjAUrKZBPZskgNvjhQPYH6ZKYCJDloUzw4aTiAe351dtkIcP5qQm6WaXYfbVFZfLhQ0KNZXZXz0ZRqHS7mXZ4-d1rvNelubWv-xvABnRzHz</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF</title><source>esp@cenet</source><creator>KEGELER, Jörg</creator><creatorcontrib>KEGELER, Jörg</creatorcontrib><description>Multi-layer printed circuit boards and methods of producing the same are disclosed. In one example, a multi-layer printed circuit board may include flat coils which are situated vertically one above the other and are connected electrically in series or in parallel in order to form a first solenoid coil. Two vertically adjacent flat coils may be arranged laterally offset in relation to one another in such a way that conductor track sections of one flat coil are arranged so as to vertically partially overlap with two conductor track sections of the other flat coil in a cross section perpendicular to a surface of the multi-layer printed circuit board.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180919&amp;DB=EPODOC&amp;CC=EP&amp;NR=3375261A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180919&amp;DB=EPODOC&amp;CC=EP&amp;NR=3375261A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KEGELER, Jörg</creatorcontrib><title>MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF</title><description>Multi-layer printed circuit boards and methods of producing the same are disclosed. In one example, a multi-layer printed circuit board may include flat coils which are situated vertically one above the other and are connected electrically in series or in parallel in order to form a first solenoid coil. Two vertically adjacent flat coils may be arranged laterally offset in relation to one another in such a way that conductor track sections of one flat coil are arranged so as to vertically partially overlap with two conductor track sections of the other flat coil in a cross section perpendicular to a surface of the multi-layer printed circuit board.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwjAQQLM4iPoP9wMdalDnmFzNQZor4SI4SCkSJ9FC_X9UEFydHo_35urc5iBUBXPCBF2iKOjAUrKZBPZskgNvjhQPYH6ZKYCJDloUzw4aTiAe351dtkIcP5qQm6WaXYfbVFZfLhQ0KNZXZXz0ZRqHS7mXZ4-d1rvNelubWv-xvABnRzHz</recordid><startdate>20180919</startdate><enddate>20180919</enddate><creator>KEGELER, Jörg</creator><scope>EVB</scope></search><sort><creationdate>20180919</creationdate><title>MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF</title><author>KEGELER, Jörg</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3375261A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>KEGELER, Jörg</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KEGELER, Jörg</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF</title><date>2018-09-19</date><risdate>2018</risdate><abstract>Multi-layer printed circuit boards and methods of producing the same are disclosed. In one example, a multi-layer printed circuit board may include flat coils which are situated vertically one above the other and are connected electrically in series or in parallel in order to form a first solenoid coil. Two vertically adjacent flat coils may be arranged laterally offset in relation to one another in such a way that conductor track sections of one flat coil are arranged so as to vertically partially overlap with two conductor track sections of the other flat coil in a cross section perpendicular to a surface of the multi-layer printed circuit board.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3375261A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
title MULTI-LAYER PRINTED CIRCUIT BOARD HAVING A PRINTED COIL AND METHOD FOR THE PRODUCTION THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T21%3A34%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KEGELER,%20J%C3%B6rg&rft.date=2018-09-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3375261A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true