METHOD AND DEVICE FOR CHARACTERIZING A WAFER PATTERNED USING AT LEAST ONE LITHOGRAPHY STEP

In an aspect, a plurality of parameters characteristic of the patterned wafer are determined based on measurements of the intensity of electromagnetic radiation after the diffraction thereof at the patterned wafer. The intensity measurements are carried out for at least one used structure and at lea...

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Bibliographische Detailangaben
Hauptverfasser: STIEPAN, Hans-Michael, MANTZ, Ulrich, ZOTT, Andy
Format: Patent
Sprache:eng ; fre ; ger
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